 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| BAL99, BAV99 Small Signal Diodes SOT-23 .122 (3.1) .118 (3.0) .016 (0.4) 3 FEATURES Silicon Epitaxial Planar Diode Top View .056 (1.43) .052 (1.33) Fast switching diodes, especially suited for automatic insertion. This diode is also available in other configurations including a dual common cathode with type designation BAV70 and a dual common anode with type designation BAW56. .045 (1.15) .037 (0.95) 1 2 max. .004 (0.1) .007 (0.175) .005 (0.125) .037(0.95) .037(0.95) .016 (0.4) .016 (0.4) .102 (2.6) .094 (2.4) MECHANICAL DATA Case: SOT-23 Plastic Package Weight: approx. 0.008 g Dimensions in inches and (millimeters) 3 3 Top View 1 2 1 2 Top View BAL99 Marking: JF BAV99 Marking: JE MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings for a single diode at 25 C ambient temperature unless otherwise specified. Symbol Reverse Voltage, Peak Reverse Voltage Forward Current (continuous) Non-Repetitive Peak Forward Current at t = 1 s at t = 1 ms at t = 1 s Power Dissipation at Tamb = 25 C Junction Temperature Storage Temperature Range 1) Value 70 250 2 1 0.5 3501) 150 -65 to +150 Unit V mA A A A mW C C V R, VRM IF IFSM IFSM IFSM Ptot Tj TS Device on fiberglass substrate, see layout. 4/98 BAL99, BAV99 ELECTRICAL CHARACTERISTICS Ratings for one diode at 25 C ambient temperature unless otherwise specified Symbol Forward Voltage at IF = 1 mA at IF = 10 mA at IF = 50 mA at IF = 150 mA Leakage Current at VR = 70 V at VR = 70 V, Tj = 150 C at VR = 25 V, Tj = 150 C Capacitance at VF = VR = 0; f = 1 MHz Reverse Recovery Time from IF = 10 mA to IR = 10 mA measured at IR = 1 mA, RL = 100 Thermal Resistance Junction to Ambient Air 1) Min. - - - - - - - - - Typ. - - - - - - - - - Max. 0.715 0.855 1.0 1.25 2.5 100 30 1.5 6 Unit V V V V A A A pF ns VF VF VF VF IR IR IR Ctot trr RthJA - - 4301) K/W Device on fiberglass substrate, see layout. .30 (7.5) .12 (3) .04 (1) .08 (2) .04 (1) .08 (2) .59 (15) .47 (12) .03 (0.8) 0.2 (5) .06 (1.5) .20 (5.1) Dimensions in inches (millimeters) Layout for RthJA test Thickness: Fiberglass 0.059 in (1.5 mm) Copper leads 0.012 in (0.3 mm) |
Price & Availability of BAV99
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |